Pinless
211 registration
bonding system
by
Cedal Equipment
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| Encouraged by the success of the Pinless bonding 190 (with optical registration and two layup tables) which is used by several customers in asia, Cedal Equipment has developed another machine specially for the european market. Like the Bonding 190 the Indudond 211 registrates the innerlayers with the help of two cameras. On customers demand it is possible to equip the layup table of the Bonding 211 with pins so that the registration system can be choosen according to the requirements of the materials which have to be bonded. The heating rate and a lot of other parameters can be easily set in the userfriendly software. The biggest advantage of the pinless system is that there is nomore a need to drill or punch registration holes into prepreg and innerlayers for layup purposes. This means a reduction of tolerances (tolerances from drilling or punching are cancelled out) and also a reduction of costs: One workstep is cancelled out and prepreg is much cheape without punched holes. |  |
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| - | No punching or drilling for layup purposes after etching needed |
| - | No riveting needed |
| - | Reduction of press costs: No special press tooling for innerlayer registration needed |
| - | Multilayerthickness up to 10 mm can be processed (registration testet - till now - with 24 innerlayers) |
| - | Low energy consumption (compared with traditional thermobonding machines) |
| - | Higher flexibility: Free programming of temperature profile according to the multilayer layup and the possibility to use the registration system accordung to the requirements of the materials which have to be welded. |
| - | Higher overall accuracy: Tolerances from drilling or punching are cancelled out |
| - | Cost reduction: No costs for drilling or punching holes into prepreg and innerlayers |
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Innerlayers resp. multilayer features |
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| - Size: | Min: 304 X 457 mm | |
| Max: 584 x 635 mm | ||
| - Innerlayers thickness: | 0,05 - 1 mm | |
| - Target shape: | round | |
| - Multilayer thickness: | Min: No limit | |
| Max: 10 mm | ||
| - Copper thickness: | Min: 12 µm | |
| Max: 140 µm | ||
Machine features |
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| - Registration accuracy: | 50 µm pad to pad | |
| - Maximum working temperature: | 300 °C | |
| - Maximum bond pressure: | 16 kg/cm² | |
| - Electrical connection: | connection = 3 phases + ground, | |
| voltage on request | ||
| Connection power = 14 KVA | ||
| - Compressed air connection | pressure = 7 bar | |
| consumption = very low | ||
| - Size: | L 2560 mm x W 1540 mm x H 1730 | |
| - Working Level: | 1000 - 1050 mm | |
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Brochure Pinless 211 GSI (DE) - Brochure Pinless 211 Cedal Equipment (DE) - Brochure Pinless 211 Cedal Equipment (EN) For opening this documents a PDF reader is needed. Here you can get for example the "Foxit Reader". All statements made on this page and in the PDF documents are not binding, drawings and images may differ from reality. Changes can be done without any notification! |
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